Pellicle for lithography
US9341943B2 · kind B2 · utility
6Cited by
3References
3Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 12, 2015 |
| Grant date | May 17, 2016 |
| Priority date | — |
| Expiry date | Mar 12, 2035 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/2002
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
There is provided a pellicle having a frame 12, a film 11 and an adhesive 13 for bonding the film 11 to the frame 12, and this adhesive 13 is a silicone compound having a low outgassing tendency and high heat resistance; in a better mode case, it can maintain its adhesive strength at temperatures 100-200 degrees C. and it exhibits results of TML being 1.0% or lower and CVCM being 0.1% or lower when tested in accordance with ASTM E595-93; thus this pellicle is useful for EUV light exposure lithography.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.