Patent · US Active

Method and apparatus for performing pattern alignment to die

US9341962B2 · kind B2 · utility

2Cited by

32References

29Claims

0Family size

Assignee

Mycronic AB · SE

Inventors

Mikael Wahlsten · Stockholm, SE
Per Gustafsson · Bjärred, SE

Key dates

Filing date	Feb 28, 2011
Grant date	May 17, 2016
Priority date	—
Expiry date	Oct 29, 2032

Classification

Technology area (CPC H)Electricity
CPC primaryH05K3/4679
WIPO fieldOptics
WIPO sectorInstruments

Abstract

In a method for patterning a workpiece provided with dies in a direct write machine, pattern data associated with a selected die, or group of dies, is transformed into adjusted circuit pattern data dependent both on the original pattern data and the transformed positions, wherein the adjusted circuit pattern data represents the circuit pattern of the plurality of dies, or group of dies, such that the adjusted circuit pattern is fitted to a plurality of sub-areas of the workpiece area, and wherein each sub-area is associated with a die, or group of dies, among the plurality of dies distributed on the workpiece. A pattern is then written on the workpiece according to the adjusted circuit pattern data.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.