Cooling system for electronic components
US9342121B2 · kind B2 · utility
2Cited by
37References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 3, 2009 |
| Grant date | May 17, 2016 |
| Priority date | — |
| Expiry date | Apr 25, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Embodiments of the present invention provide for non interruptive fluid cooling of an electronic enclosure. One or more electronic component packages may be removable from a circuit card having a fluid flow system. When installed, the electronic component packages are coincident to and in a thermal relationship with the fluid flow system. If a particular electronic component package becomes non-functional, it may be removed from the electronic enclosure without affecting either the fluid flow system or other neighboring electronic component packages.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.