Patent · US Active

Metal-insulator-metal capacitor and method for manufacturing thereof

US9343298B2 · kind B2 · utility

2Cited by
1References
23Claims
0Family size

Assignee

Inventors

Key dates

Filing dateSep 26, 2011
Grant dateMay 17, 2016
Priority date
Expiry dateApr 3, 2033

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH10D1/684
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

The disclosure provides a method for producing a stack of layers on a semiconductor substrate. The method includes producing a substrate a first conductive layer; and producing by ALD a sub-stack of layers on said conductive layer, at least one of said layers of the sub-stack being a TiO2 layer, the other layers of the sub-stack being layers of a dielectric material having a composition suitable to form a cubic perovskite phase upon crystallization of said sub-stack of layers. Crystallization is obtained via heat treatment. When used in a metal-insulator-metal capacitor, the stack of layers can provide improved characteristics as a consequence of the TiO2 layer being present in the sub-stack.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.