Metal-insulator-metal capacitor and method for manufacturing thereof
US9343298B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 26, 2011 |
| Grant date | May 17, 2016 |
| Priority date | — |
| Expiry date | Apr 3, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D1/684
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The disclosure provides a method for producing a stack of layers on a semiconductor substrate. The method includes producing a substrate a first conductive layer; and producing by ALD a sub-stack of layers on said conductive layer, at least one of said layers of the sub-stack being a TiO2 layer, the other layers of the sub-stack being layers of a dielectric material having a composition suitable to form a cubic perovskite phase upon crystallization of said sub-stack of layers. Crystallization is obtained via heat treatment. When used in a metal-insulator-metal capacitor, the stack of layers can provide improved characteristics as a consequence of the TiO2 layer being present in the sub-stack.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.