Semiconductor device
US9343384B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 11, 2015 |
| Grant date | May 17, 2016 |
| Priority date | — |
| Expiry date | Mar 11, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D18/60
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes a semiconductor chip comprising a first and second terminal surfaces. An insulator surrounds an outer circumference of a side surface of the chip. A reinforcing-member is arranged between the side surface of the chip and an inner side surface of the insulator and surrounds the outer circumference of the side surface of the chip. A first and second holders hold the reinforcing-member therebetween at a top and bottom surfaces of the reinforcing-member. The first and second holders comprise protrusions facing an inner wall surface of the reinforcing-member, and the when φ1in represents an inner-diameter of parts of the reinforcing-member opposing to the protrusions, φ1out represents an outer-diameter of the reinforcing-member, φ2 represents an outer-diameter of the protrusion of either the first or the second holder, and φ3 represents an inner diameter of the insulator, the following Expression 1 is satisfied φ1in−φ2<φ1out.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.