Semiconductor packages having a guide wall and related systems and methods
US9343535B2 · kind B2 · utility
7Cited by
6References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 6, 2013 |
| Grant date | May 17, 2016 |
| Priority date | — |
| Expiry date | Oct 31, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1815
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor package includes a first package board, a first semiconductor chip arranged on the first package board, a heat transfer layer arranged on the first semiconductor chip, a heat spreader arranged on the heat transfer layer, and a housing having a molding part arranged on the first package board and directly surrounding side surfaces of the first semiconductor chip and a guide wall arranged on the molding part, with the guide wall spaced apart from the heat spreader and surrounding side surfaces of the heat spreader.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.