Method for producing at least one radiation-emitting and/or -receiving semiconductor component, and semiconductor component
US9343596B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 21, 2012 |
| Grant date | May 17, 2016 |
| Priority date | — |
| Expiry date | Sep 24, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/857
Abstract
A method for producing a radiation-emitting or radiation-receiving semiconductor component is specified. In a method step, a carrier body having a mounting surface is provided. In a further method step, a barrier frame is formed on the mounting surface, in such a way that the barrier frame laterally encloses a mounting region of the mounting surface. In a further method step, a radiation-emitting or radiation-receiving semiconductor chip is mounted within the mounting region on the mounting surface. The semiconductor chip is potted with a liquid lens material, wherein the lens material is applied to the mounting surface within the mounting region. The lens material is cured. The mounting surface, the barrier frame and the lens material are adapted to one another.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.