Device and method for precipitating a layer on a substrate
US9343610B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 16, 2014 |
| Grant date | May 17, 2016 |
| Priority date | — |
| Expiry date | Sep 16, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E10/541
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The invention relates to a device for depositing a layer made of at least two components on an object, with a deposition chamber for disposing the object, at least one source with material to be deposited, as well as at least one device for controlling the deposition process, implemented such that the concentration of at least one component of the material to be deposited can be modified in its gas phase prior to deposition on the substrate by selective binding of a specified quantity of the at least one component, wherein the selectively bound quantity of the at least one component can be controlled by modifying at least one control parameter that is actively coupled to a binding rate or the component. It further relates to a device for depositing a layer made of at least two components on an object, wherein a device for controlling the deposition process has at least one gettering element made of a reactive material, wherein the reactive material includes copper and/or molybdenum. It further relates to a method for depositing a layer made of at least two components on an object, wherein a selectively bound quantity of at least one component is controlled by modifying a binding ra…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.