Method for producing an optoelectronic semiconductor chip and optoelectronic semiconductor chip
US9343615B2 · kind B2 · utility
1Cited by
2References
17Claims
0Family size
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Key dates
| Filing date | Aug 23, 2012 |
| Grant date | May 17, 2016 |
| Priority date | — |
| Expiry date | Oct 9, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of producing an optoelectronic semiconductor chip includes providing a growth substrate, producing a III nitride nucleation layer on the growth substrate by sputtering, wherein a material of the growth substrate differs from a material of the nucleation layer, and growing a III nitride semiconductor layer sequence having an active layer onto the nucleation layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.