Encapsulation housing and LED module with the same
US9343632B2 · kind B2 · utility
0Cited by
1References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 11, 2012 |
| Grant date | May 17, 2016 |
| Priority date | — |
| Expiry date | May 11, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/036
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
An encapsulation housing for a LED module, may include an upper housing and a lower housing joined together and defining together a cavity, wherein at least one of the upper housing and the lower housing has an inner partition wall partitioning the cavity into an assembly cavity and an anti-leakage cavity encircling the assembly cavity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.