Light emitting diode module for surface mount technology and method of manufacturing the same
US9343644B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 2, 2015 |
| Grant date | May 17, 2016 |
| Priority date | — |
| Expiry date | Jan 2, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/84
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Provided is a light emitting diode (LED) in which a side surface of a reflective metal layer has a predetermined angle, and occurrence of cracks in a conductive barrier layer formed on the reflective metal layer can be prevented. Also, an LED module using LEDs is disclosed. A reflection pattern electrically connected to a second semiconductor layer is partially exposed by patterning a first insulating layer. Accordingly, a first pad is formed through the partially opened first pad region. Also, a conductive reflection layer electrically connected to a first semiconductor layer forms a second pad region formed by patterning a second insulating layer. A second pad is formed on the second pad region.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.