Implantable medical device header

US9345185B2 · kind B2 · utility

Assignee

• Medtronic, Inc. · US

Inventors

• Jeevan M. Prasannakumar · Circle Pines, US
• Christopher M. Haenisch · Fridley, US
• David Bates · Fayetteville, US
• John C. Olson · Maple Grove, US
• George Patras · Greenfield, US
• Yanzhu Zhao · Blaine, US
• Jason P. Weiand · Rockford, US

Key dates

• Filing date: Nov 14, 2012
• Grant date: May 17, 2016
• Expiry date: Apr 10, 2034

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01Q9/42
• WIPO field: Medical technology
• WIPO sector: Instruments

Abstract

Techniques for forming a header for an implantable medical device via a two-shot molding process are described. The two-shot molding processes may include a first molding step that creates a first-shot assembly and a second molding step that creates a second-shot assembly. The first-shot assembly may be formed to include one or more protrusions configured to interact with a second-shot mold and/or molding material in the second molding step. The second molding step may be configured to overmold the first-shot assembly. The header may include an attachment plate at least partially embedded in molding material and configured to be mechanically coupled to a body of the implantable medical device.