Multi-wavelength laser processing systems and associated methods of use and manufacture
US9346122B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 8, 2013 |
| Grant date | May 24, 2016 |
| Priority date | — |
| Expiry date | Nov 23, 2034 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K26/082
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Laser processing systems for processing one or more materials or combination of materials with composite laser energy and associated systems and methods are disclosed herein. In several embodiments, for example, a laser processing system includes one or more laser sources that provide a first plurality of first laser beams and preconditioning optics that combine the first laser beams into a first composite beam. The system also includes recomposition optics that separate the first composite beam into second plurality of second laser beams and combine the second laser beams into a second composite beam. The system further includes beam modification optics that modify wave fronts of one or more of the individual second laser beams such that the second composite beam has one or more beam characteristics that are modified relative to corresponding beam characteristics of the first composite beam. For example, the second laser beams of the second composite beam can focus at a common focusing plane.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.