Nickel-based solder alloy
US9346131B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 16, 2011 |
| Grant date | May 24, 2016 |
| Priority date | — |
| Expiry date | Mar 11, 2033 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF05B2230/238
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Solder alloy based on nickel is composed of a mixture with a first soldering material, a second soldering material, and a base material, wherein the base material is a nickel-based material which corresponds to the material to be soldered and is present in a proportion of 45-70% by weight in the mixture, the first soldering material is a nickel-based material including chromium, cobalt, tantalum, aluminum and boron, and is present in a proportion of 15-30% by weight in the mixture, and the second soldering material is a nickel-based material including chromium, cobalt, molybdenum, tungsten, boron and hafnium, and is present in a proportion of 15-25% by weight in the mixture.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.