Patent · US Active

Nickel-based solder alloy

US9346131B2 · kind B2 · utility

2Cited by
11References
8Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJun 16, 2011
Grant dateMay 24, 2016
Priority date
Expiry dateMar 11, 2033

Classification

  • Technology area (CPC F)Mechanical Engineering; Lighting; Heating
  • CPC primaryF05B2230/238
  • WIPO fieldMachine tools
  • WIPO sectorMechanical engineering

Abstract

Solder alloy based on nickel is composed of a mixture with a first soldering material, a second soldering material, and a base material, wherein the base material is a nickel-based material which corresponds to the material to be soldered and is present in a proportion of 45-70% by weight in the mixture, the first soldering material is a nickel-based material including chromium, cobalt, tantalum, aluminum and boron, and is present in a proportion of 15-30% by weight in the mixture, and the second soldering material is a nickel-based material including chromium, cobalt, molybdenum, tungsten, boron and hafnium, and is present in a proportion of 15-25% by weight in the mixture.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.