Epoxy resin blend dispersion and a process for preparing the dispersion
US9346925B2 · kind B2 · utility
3Cited by
17References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 24, 2013 |
| Grant date | May 24, 2016 |
| Priority date | — |
| Expiry date | Jun 24, 2033 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08J2463/00
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
The present invention relates to an aqueous epoxy resin blend dispersion of a high mw epoxy resin and a liquid epoxy resin with a dispersant having an interfacial tension such that a drop of the mixture of the dispersant in a melt of the epoxy resin blend against water is less than 2 dynes/cm, preferably less than 1 dyne/cm, and a process for preparing this epoxy resin blend dispersion. Specifically, the process is a solvent free melt kneading or shearing dispersion process wherein the dispersion is processed at from 50 to 150° C., and the resulting dispersion is stable.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.