Adhesive composition and structure comprising at least one layer of the said composition
US9346988B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 2, 2009 |
| Grant date | May 24, 2016 |
| Priority date | — |
| Expiry date | May 12, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31728
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The invention relates to an adhesive composition comprising at least one polyamide A, with a mean number of carbon atoms per nitrogen atom (C/N), noted CA, of between 4 and 8.5; at least one polyamide B, with a melting point of greater than or equal to 180° C. and a mean number C/N, noted CB, of between 7 and 10; at least one polyamide C, with a mean number C/N, noted CC, of between 9 and 18; at least 50% by weight of the said composition being formed from one or more polyamides chosen from polyamides A, B and C, the mass-weighted mean of the heats of fusion of these polyamides in the said composition being greater than 25 J/g (DSC), the mean number of C/N of the polyamides A, B and C satisfying the following strict inequality: CA<CB<CC, and also to multilayer structures.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.