Reduced pressure drying method and device of a substrate
US9347706B2 · kind B2 · utility
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22References
16Claims
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Key dates
| Filing date | May 23, 2013 |
| Grant date | May 24, 2016 |
| Priority date | — |
| Expiry date | Jul 24, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67034
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
A reduced pressure drying method and device for a substrate are presented. Firstly, a substrate is placed in a sealed space; then the surface to-be-dried of the substrate is partitioned into a predetermined number of sealed regions; thereafter, the sealed regions are subjected to pressure reduction through gas extraction; finally, the sealed regions are dried through gas insufflation, and then the substrate is taken out from the sealed space. The method can perform reduced pressure drying to various-sized substrates, ensuring uniform pressure and humidity and avoiding formation of reduced pressure drying speckles.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.