Methods and systems for rapidly testing adhesion
US9347868B2 · kind B2 · utility
4Cited by
14References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 11, 2013 |
| Grant date | May 24, 2016 |
| Priority date | — |
| Expiry date | Sep 8, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/10
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Adhesion testing systems, methods of fabrication, and methods of testing are disclosed. Test systems include test coupons with non-metallic test adherends. Test coupons are configured to test bonds to the non-metallic test adherends under peeling stress and/or shearing stress. Test methods are simplified and rapid as compared to standard adhesion tests and include methods of accelerated environmental testing. Test methods also are adapted for qualitative and quantitative measurement of bond performance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.