Method to improve strain rate control of small lead free printed circuit board assembly during in circuit test process
US9347984B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 25, 2014 |
| Grant date | May 24, 2016 |
| Priority date | — |
| Expiry date | Jan 26, 2035 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2808
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An apparatus includes a top plate and an extension card surrounding a space for a small electronic assembly. The extension card and small electronic assembly are mounted to the top plate. The apparatus includes a plurality of test probes extending through the top plate and moving relative to the top plate. A portion of the test probes are positioned to contact the extension card and a portion are positioned to contact the small electronic assembly when the test probes move with respect to the top plate. The apparatus includes a vacuum box in contact with the top plate and surrounding the extension card and small electronic assembly. The top plate moves relative to the test probes so the test probes contact the extension card and the small electronic assembly in response to a vacuum force evacuating an area under the top plate and within the vacuum box.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.