Thermal isolation techniques
US9348377B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 3, 2014 |
| Grant date | May 24, 2016 |
| Priority date | — |
| Expiry date | Jun 13, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20518
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Various embodiments described herein include systems, methods and/or devices used to dissipate heat generated by electronic components in an electronic system (e.g., a memory system that includes closely spaced memory modules). In one aspect, an electronic assembly includes a first circuit board with one or more heat generating components coupled thereto. The electronic assembly further includes a second circuit board with one or more heat sensitive components coupled thereto. The electronic assembly also includes a thermal barrier interconnect. The thermal barrier interconnect electrically couples the first circuit board to the second circuit board. In some embodiments, thermal barrier interconnect is a flexible interconnect with a lower thermal conductivity than the first circuit board and the second circuit board. The thermal barrier interconnect forms a thermal barrier between the first and second circuit boards which protects the heat sensitive components from the heat generating components.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.