Dynamic thermal budget allocation for memory array
US9348380B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 30, 2014 |
| Grant date | May 24, 2016 |
| Priority date | — |
| Expiry date | Nov 22, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02D10/00
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Embodiments of the present inventive concept relate to systems and methods for dynamically allocating and/or redistributing thermal budget to each memory group in a memory array from a total memory thermal budget based on the workload of each memory group. In this manner, the memory groups having a higher workload can receive a higher thermal budget. The allocation can be dynamically adjusted over time. Thus, the individual and overall memory group performance increases while efficiently allocating the total thermal budget. By dynamically sharing the total thermal budget of the system, the performance of the system as a whole is increased, thereby lowering, for example, the total cost of ownership (TCO) of datacenters.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.