Apparatus including temperature-dependent exchange spring mechanism
US9349402B2 · kind B2 · utility
8Cited by
6References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 10, 2015 |
| Grant date | May 24, 2016 |
| Priority date | — |
| Expiry date | Feb 10, 2035 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11B2005/0021
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Provided herein is an apparatus comprising a substrate; a continuous layer over the substrate comprising a first heat sink layer; and a plurality of features over the continuous layer comprising a second heat sink layer, a first magnetic layer over the second heat sink layer, and a second magnetic layer, wherein the first and second magnetic layers are configured to provide a temperature-dependent, exchange spring mechanism.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.