Method for producing microcarriers
US9349545B2 · kind B2 · utility
0Cited by
3References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 22, 2013 |
| Grant date | May 24, 2016 |
| Priority date | — |
| Expiry date | Jul 22, 2033 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81B2201/06
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The present invention relates to a method for producing microcarriers comprising the following steps: (a) providing a wafer having a sandwich structure comprising a bottom layer, a top layer and an insulating layer located between said bottom and top layers, (b) etching away the top layer to delineate lateral walls of bodies of the microcarriers, (c) depositing a first active layer at least on a top surface of the bodies, (d) applying a continuous polymer layer over the first active layer, (e) etching away the bottom layer and the insulating layer, (f) removing the polymer layer to release the microcarriers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.