Thin film capacitors embedded in polymer dielectric
US9349788B2 · kind B2 · utility
9Cited by
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27Claims
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Key dates
| Filing date | Aug 8, 2013 |
| Grant date | May 24, 2016 |
| Priority date | — |
| Expiry date | Nov 5, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/162
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A substrate comprising a capacitor comprising metal electrodes and a ceramic or metal oxide dielectric layer, the capacitor being embedded in a polymer based encapsulating material and connectable to a circuit via a via post standing on said capacitor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.