Laser processing method and device
US9352414B2 · kind B2 · utility
3Cited by
58References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 13, 2004 |
| Grant date | May 31, 2016 |
| Priority date | — |
| Expiry date | Mar 7, 2028 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2103/50
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A laser processing method having a displacement acquiring step of acquiring a displacement between a point on the cutting line and one end of the cutting line in the object while irradiating the object with a second laser beam, converged by a lens, for measuring the displacement of a main surface of the object; and a position setting step of setting an initial position for holding the lens with respect to the main surface of the object according to the acquired displacement, and holding the lens at thus set initial position.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.