Porous media heat transfer for injection molding
US9352502B2 · kind B2 · utility
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18References
20Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 24, 2014 |
| Grant date | May 31, 2016 |
| Priority date | — |
| Expiry date | Jul 17, 2034 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29C33/3814
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
The cooling of injection molded plastic is targeted. Coolant flows into a porous medium disposed within an injection molding component via a porous medium inlet. The porous medium is thermally coupled to a mold cavity configured to receive injected liquid plastic. The porous medium beneficially allows for an increased rate of heat transfer from the injected liquid plastic to the coolant and provides additional structural support over a hollow cooling well. When the temperature of the injected liquid plastic falls below a solidifying temperature threshold, the molded component is ejected and collected.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.