Direct imprinting of porous substrates
US9352543B2 · kind B2 · utility
2Cited by
14References
29Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 31, 2010 |
| Grant date | May 31, 2016 |
| Priority date | — |
| Expiry date | Jan 15, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T436/143333
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Provided are methods of patterning porous materials on the micro- and nanometer scale using a direct imprinting technique. The present methods of direct imprinting of porous substrates (“DIPS”), can utilize reusable stamps that may be directly applied to an underlying porous material to selectively, mechanically deform and/or crush particular regions of the porous material, creating a desired structure. The process can be performed in a matter of seconds, at room temperature or higher temperatures, and eliminates the requirement for intermediate masking materials and etching chemistries.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.