Melt molding method of germanium
US9352997B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jun 27, 2013 |
| Grant date | May 31, 2016 |
| Priority date | — |
| Expiry date | Aug 2, 2034 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B1/02
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
In a melt molding method of germanium, the germanium which is brought into a molten state is sealed in molding dies in an inert gas atmosphere. The molding dies are temperature-controlled from the outside. While gradually cooling the molding dies at a portion or a plurality of portions thereof up to the whole, the germanium is gradually solidified from a side of the portion or sides of the plurality of portions up to the whole. An external ambient temperature of the molding dies is controlled to decrease gradually while ensuring a temperature below a germanium melting point temperature but higher than an inner temperature of the molding die which is cooled. After solidification of the germanium is completed, cooling of the molding dies is continued, and the external ambient temperature is decreased to mold the germanium.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.