Thermal interface material and method of making and using the same
US9353304B2 · kind B2 · utility
5Cited by
17References
24Claims
0Family size
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Key dates
| Filing date | Dec 22, 2009 |
| Grant date | May 31, 2016 |
| Priority date | — |
| Expiry date | Aug 5, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A thermal interface material comprises a polymeric elastomer material, a thermally conductive filler, and a coupling agent, along with other optional components. In one exemplary heat transfer material, a coupling agent having the formula:
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.