Composition for removing and preventing formation of oxide on the surface of metal wire
US9353339B2 · kind B2 · utility
1Cited by
0References
6Claims
0Family size
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Key dates
| Filing date | Jul 24, 2013 |
| Grant date | May 31, 2016 |
| Priority date | — |
| Expiry date | Jul 24, 2033 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC11D2111/22
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
The present invention proposes a method for removing an oxide formed on the surface of a copper film used in the process of manufacturing a circuit for a semiconductor, an organic light-emitting diode, an LED, or a liquid crystal display without causing corrosion on a lower metal film. The composition including corrosive amine may remove a metal oxide depending on the content of additive ranging from 0.01 to 10% regardless of the content of ultrapure water. A polar solvent other than the corrosive amine may efficiently remove an oxide from the surface of the metal when the same contains water and 0.01 to 20% of the additive.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.