Patent · US Active

Dielectrophoresis and electrodeposition process for selective particle entrapment

US9353455B2 · kind B2 · utility

0Cited by
0References
15Claims
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Assignee

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Key dates

Filing dateFeb 25, 2014
Grant dateMay 31, 2016
Priority date
Expiry dateMar 23, 2034

Classification

  • Technology area (CPC C)Chemistry; Metallurgy
  • CPC primaryC25D15/00
  • WIPO fieldSurface technology, coating
  • WIPO sectorChemistry

Abstract

A method of creating a structure on an electrode includes exposing an electrode to a solution containing a polymerizable monomer and particles and applying an AC voltage to the electrode so as to induce positive DEP on the particles and to draw the particles toward the electrode. An offset voltage is applied to the electrode (which can be DC or AC) to form an electrically conductive polymer thereon from the polymerizable monomer, wherein the particles are entrapped on or within the polymer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.