Stress compensation patterning
US9355967B2 · kind B2 · utility
5Cited by
3References
31Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 19, 2013 |
| Grant date | May 31, 2016 |
| Priority date | — |
| Expiry date | Aug 14, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3511
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
An apparatus includes a device that includes at least one layer. The at least one layer includes an inter-device stress compensation pattern configured to reduce an amount of inter-device warpage prior to the device being detached from another device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.