Coefficient of thermal expansion compensating compliant component
US9357634B2 · kind B2 · utility
0Cited by
8References
72Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 25, 2013 |
| Grant date | May 31, 2016 |
| Priority date | — |
| Expiry date | Sep 11, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49121
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An improved discrete electronic device and method of making the improved discrete electronic device is described. The discrete electronic device has an electronic passive component with a termination and a lead frame. A compensating compliant component is between the termination and the lead frame. The compensating compliant component has a composite core and a first conductor on the composite core. The first conductor is in electrical contact with the termination. A second conductor is also on the composite core wherein the second conductor is in electrical contact with the lead frame.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.