Molded package and light emitting device
US9357641B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 18, 2013 |
| Grant date | May 31, 2016 |
| Priority date | — |
| Expiry date | Apr 5, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/18301
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A molded package includes a molded resin and a lead. The molded resin has a recess portion provided on an upper surface of the molded resin to accommodate a light emitting component. The lead is partially exposed from a bottom surface of the recess portion of the molded resin to be electrically connected to the light emitting component and extends below a side wall of the recess portion. The lead has a groove formed on a surface of the lead at least partially along the side wall. The groove has an inside upper edge and an outside upper edge and is filled with the molded resin so that the inside upper edge is exposed from the bottom surface of the recess portion and the outside upper edge is embedded within the molded resin.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.