Patent · US Active

Method for solderless electrical press-fit contacting of electrically conductive press-fit pins in circuit boards

US9357656B2 · kind B2 · utility

1Cited by

2References

10Claims

0Family size

Assignee

Robert Bosch GmbH · DE

Inventors

Patrik Patzner · Leonberg, DE
Carsten Kaschube · Leverkusen, DE
Christoph Gmelin · Stuttgart, DE
Andreas Otto · Fürth, DE
Markus Reinhard · Kornwestheim, DE
Ronny Wolf · Eisenach, DE

Key dates

Filing date	May 21, 2014
Grant date	May 31, 2016
Priority date	—
Expiry date	Dec 10, 2034

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T29/49139
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

A method for solderless electrical press-fit contacting of electrically conductive press-fit pins in circuit boards include: providing a circuit board having a thickness, at least one electrical conductor path, and a contacting opening guided perpendicularly through the circuit board and having a metallized inner wall; providing an electrically conductive press-fit pin having a longitudinal axis and having a press-fit region suitable for press-fitting into the contacting opening and having a substantially round cross section; and press-fitting the press-fit pin into the contacting opening by applying onto the press-fit pin a force acting along the longitudinal axis of the press-fit pin, press-fitting being assisted by the application of ultrasound acting on the press-fit pin.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.