Lead-free solder alloy for printed circuit board assemblies for high-temperature environments
US9357657B2 · kind B2 · utility
0Cited by
1References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 30, 2015 |
| Grant date | May 31, 2016 |
| Priority date | — |
| Expiry date | Jul 30, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A solder alloy suitable for high temperature environments, such as for example electronic systems used in an oil or gas well where the temperature may be in the region of 175° C., the solder alloy having a Silver weight % in the range of 3.5 to 7.0, a Copper weight % in the range of 1.0 to 4.0, and an Antimony weight % in the range of 1.0 to 3.0. Other embodiments are described and claimed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.