Method for selective laser sintering and system for selective laser sintering suitable for said method

US9358729B2 · kind B2 · utility

Assignee

• Siemens Aktiengesellschaft · DE

Inventors

• Oliver Hofacker · Berlin, DE
• Martin Schäfer · Arnstadt, DE

Key dates

• Filing date: Sep 22, 2011
• Grant date: Jun 7, 2016
• Expiry date: Jul 16, 2033

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y02P10/25
• WIPO field: Materials, metallurgy
• WIPO sector: Chemistry

Abstract

A method and a device perform selective laser sintering. In the method for laser sintering, energy is applied linearly to a cross-sectional surface of the component to be produced in order to compact the powdery material. In the case of components with cross-sectional surfaces that have a curved contour, the application of energy can be guided in a line-shaped manner following the curved contour so that the contour of the workpiece that develops is continuously replicated. Advantageously, irregularities in the contour, which are caused by the raster predetermined by the laser sintering method, can thus be largely avoided. The device for laser sintering includes a powder delivery unit which can rotate about a rotational axis located in the interior of an annularly closed cross-section of the workpiece to be produced.