MEMS package structure and method for fabricating the same
US9359190B2 · kind B2 · utility
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3References
20Claims
0Family size
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Key dates
| Filing date | Jun 30, 2014 |
| Grant date | Jun 7, 2016 |
| Priority date | — |
| Expiry date | Jun 30, 2034 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81B2201/042
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A MEMS package structure is disclosed. The MEMS package structure includes a first glass substrate on a micro-electromechanical systems (MEMS) structure, a sealant adhered between the first glass substrate and the MEMS structure; and a first moisture barrier on the sidewalls of the first glass substrate, the sealant, and the MEMS structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.