Hot-melt adhesives with improved adhesion on low-energy surfaces

US9359534B2 · kind B2 · utility

Assignee

• SIKA TECHNOLOGY AG · CH

Inventors

• Dirk Urbach · Ahrensburg, DE
• Kai Paschkowski · Jork, DE
• Martin Linnenbrink · Buxtehude, DE

Key dates

• Filing date: Feb 27, 2012
• Grant date: Jun 7, 2016
• Expiry date: May 24, 2032

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T428/31801
• WIPO field: Macromolecular chemistry, polymers
• WIPO sector: Chemistry

Abstract

A hot-melt adhesive composition, the use thereof, and a composite body including the hot-melt adhesive composition. The hot-melt adhesive composition includes a polyolefin P, which is solid at 25° C., a soft resin WH with a softening point between −10° C. and 40° C., and a polar modified polyolefin wax PW.