Method for reducing intermetallic compounds in matrix bit bondline
US9359824B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 23, 2014 |
| Grant date | Jun 7, 2016 |
| Priority date | — |
| Expiry date | Aug 25, 2034 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB22F2005/001
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
An apparatus and method for manufacturing a downhole tool that reduces failures occurring along a bondline between a cemented matrix coupled around a blank. The cemented matrix material is formed from a tungsten carbide powder, a shoulder powder, and a binder material, wherein at least one of the tungsten carbide powder or the shoulder powder is absent of any free tungsten. The blank, which optionally may be coated, is substantially cylindrically shaped and defines a channel extending from a top portion and through a bottom portion of the blank. The absence of free tungsten from at least one of the tungsten carbide powder or the shoulder powder reduces the reaction with iron from the blank, thereby allowing the control and reduction of intermetallic compounds thickness within the bondline.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.