Photoresist stripping composition for manufacturing LCD
US9360761B2 · kind B2 · utility
2Cited by
3References
5Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 19, 2010 |
| Grant date | Jun 7, 2016 |
| Priority date | — |
| Expiry date | Jul 4, 2033 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC11D2111/22
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
The present invention relates to a photoresist stripping composition for all process of manufacturing LCD, more specifically to a water-borne united photoresist stripping composition, as a weak basic composite comprising a tertiary alkanolamine, water, and an organic solvent. The composition according to the present invention prevents a corrosion of Al and Cu metal wiring in process of manufacturing LCD, has a good capability of removing photoresist, and is applied to all Al process, Cu process, an organic film process, and COA process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.