Routing signals via hinge assemblies for mobile computing devices
US9360889B2 · kind B2 · utility
16Cited by
5References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 27, 2013 |
| Grant date | Jun 7, 2016 |
| Priority date | — |
| Expiry date | Jun 5, 2034 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F1/181
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Embodiments of the invention describe a hinge assembly to rotatably couple a first housing to a second housing, wherein an interconnect extends through the hinge assembly as an incorporated portion of the hinge assembly, the interconnect to communicatively couple a component located in the first housing to a component located in a second housing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.