Structural integrity when 3D-printing objects
US9361553B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Mar 26, 2015 |
| Grant date | Jun 7, 2016 |
| Priority date | — |
| Expiry date | Mar 26, 2035 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06T2219/2021
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
In various implementations, a computing device is configured to reconstruct a 3D model, such that reconstruction of the 3D model prevents the printing of long lines typically associated with cracking, bending, or decreased structural integrity of a 3D printed object based on the 3D model. In some implementations, a sliced 3D model is analyzed to determine that a structural characteristic of the 3D model is compatible for reconstruction. The 3D model is then reconstructed based on the determination that the 3D model is compatible. Other implementations analyze the 3D model to determine whether at least a portion of the 3D model shell has a seamless body. In this regard, the 3D model is reconstructed based on determining that the shell portion has a seamless body.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.