Method for aligning substrates in different spaces and having different sizes
US9362153B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 23, 2014 |
| Grant date | Jun 7, 2016 |
| Priority date | — |
| Expiry date | Jan 30, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67092
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for aligning substrates in different spaces and having different sizes includes: capturing actual local images of two substrates; comparing specific marks in standard local feature regions of the two substrates, and obtaining specific marks in actual local feature regions of the two substrates; separately establishing actual coordinate systems of the two substrates to synthesize aligned assembly coordinate system; comparing coordinate values of the specific marks of the two substrates in the two actual coordinate systems to obtain first group of offsets, and comparing sizes of the two substrates to obtain a size difference; using the first group of offsets and the size difference to correct coordinate values of specific marks of one of the two substrates; comparing coordinate values of the specific marks of the two substrates, to obtain second group of offsets; and moving the one to a position compensated by the second group of offsets.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.