Semiconductor device comprising heat dissipating connector
US9362192B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 10, 2014 |
| Grant date | Jun 7, 2016 |
| Priority date | — |
| Expiry date | Jun 10, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
According to one embodiment, the connector includes a first portion and a second portion. The first portion is provided on the second surface of the semiconductor chip and bonded to the second electrode. The first portion has a bonding surface, a heat dissipation surface, and a side surface. The bonding surface is bonded to the second electrode of the semiconductor chip. The heat dissipation surface is opposite to the bonding surface and exposed from the resin. The side surface is tilted with respect to the bonding surface and the heat dissipation surface, and covered with the resin. The second portion protrudes from the first portion toward the second leadframe side. The second portion is thinner than the first portion and bonded to the second leadframe.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.