Heat exchange structure and cooling device comprising such a structure
US9362201B2 · kind B2 · utility
11Cited by
4References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 30, 2009 |
| Grant date | Jun 7, 2016 |
| Priority date | — |
| Expiry date | Sep 24, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat exchange structure is provided, including a primary face provided with non-through holes formed in said face, the inner surface of the holes and the surface of said primary face outside the holes being covered with nanoparticles, the inside of the holes having a non-wettability property relative to a given liquid and the surface of the face between the holes having a wettability property relative to the liquid.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.