Pre-encapsulated etching-then-plating lead frame structure with island and method for manufacturing the same
US9362214B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 12, 2014 |
| Grant date | Jun 7, 2016 |
| Priority date | — |
| Expiry date | Oct 31, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for manufacturing a lead frame structure for semiconductor packaging. The method includes providing a metal substrate having a top surface and a back surface, forming a first photoresist film on the top surface of the metal substrate, forming a top surface etching pattern in the first photoresist film using photolithography, forming a second photoresist film on the back surface of the metal substrate, forming a back surface etching pattern in the second photoresist film using photolithography, performing an etching process on the top surface and the back surface of the metal substrate, removing the first photoresist film and the second photoresist film, placing the etched metal substrate in a mold, encapsulating the etched metal substrate using the mold; and performing a plating process on the encapsulated metal substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.