Mirco-electro-mechanical system module and manufacturing method thereof
US9362257B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 10, 2015 |
| Grant date | Jun 7, 2016 |
| Priority date | — |
| Expiry date | Mar 10, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
The invention provides a micro-electro-mechanical system (MEMS) module, which includes a MEMS die stacked on an electronic circuit die. The electronic circuit die includes a substrate, the substrate including at least one through-silicon via (TSV) penetrating through the substrate; and at least one electronic circuit. The electronic circuit includes a circuit region, and a signal transmission layer directly connecting the TSV. At least one wire is connected between a middle part of the MEMS die and the TSV. There is no signal communication at the interfacing location where the MEMS die is stacked on and bonded with the electronic circuit die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.