Contacting an optoelectronic semiconductor component through a conversion element and corresponding optoelectronic semiconductor component

US9362466B2 · kind B2 · utility

Assignee

• OSRAM Opto Semiconductors GmbH · DE

Inventors

• Hans-Christoph Gallmeier · Regensburg, DE
• Michael Kruppa · Geisenfeld, DE
• Raimund Schwarz · Erlangen, DE
• Guenter Spath · Regensburg, DE

Key dates

• Filing date: Sep 22, 2014
• Grant date: Jun 7, 2016
• Expiry date: Sep 22, 2034

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10H20/831

Abstract

A method for manufacturing an optoelectronic semiconductor component, comprising: providing a semiconductor chip in a composite wafer, comprising an active side for emitting a primary radiation and a contact terminal which is arranged on the active side; depositing a coupling element on the active side; attaching a luminescence conversion element, for converting part of the primary radiation into a secondary radiation, to the coupling element.