Method for bonding substrates, method for manufacturing sealing structure, and method for manufacturing light-emitting device
US9362522B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 22, 2013 |
| Grant date | Jun 7, 2016 |
| Priority date | — |
| Expiry date | Feb 20, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K59/8722
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
An object is to improve productivity related to a laser light irradiation step in a bonding technique of substrates using glass frit. A highly airtight sealing structure or a highly airtight light-emitting device, which can be manufactured with high productivity, is provided. When a glass layer by melting glass frit or a sintered body by sintering glass frit is irradiated with laser light, in order to increase the efficiency, a light-absorbing material is attached to a surface of the glass layer. The laser light irradiation is performed on the light-absorbing material and the glass layer. The substrates are fixed with the glass layer therebetween.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.